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Terahertz Spectroscopic / Imaging Analysis System
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Electronic Measuring Instruments
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The E-Beam direct-write model with high resolution, has a long history in research and development areas and in manufacturing process of advanced LSIs for small production. However, it has been used by only a limited number of users for commercial device manufacturing processes. We think two issues need to be solved before the E-Beam direct-write model gains greater acceptance and our customers can take advantages of it. The first is relieving any anxiety our customers might have in using E-Beam direct-write model. The second concerns the efficient extraction of blocks. We take pride in being a challenger in this field, and will continue to make efforts in overcoming difficulties ahead of us.
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Overcoming Low Throughput by Block Exposure |
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The throughput of an EBDW model is as much as 100 times lower than the throughput provided with optical lithography. Moreover, it is expected to deteriorate further as miniaturization progresses and the degree of integration improves, since this increases the number of rectangles and thus shots per unit area.
The best way to overcome this issue is to use partial batch exposure by blocks. Block exposure, described in the section "About EBDW Technology," refers to lithography in which repeating patterns are made into a stamp and then written with a beam.
In this way, the total number of shots can be reduced by an order of magnitude and throughput doubled or tripled. Since the efficiency of block exposure technology is not pegged to the size of patterns, throughput will not be significantly degraded even as miniaturization continues to improve. It is even possible that this tool could sever the correlation between the size of a pattern and the number of shots needed to write it.
Moreover, if the multibeam exposure system moves from concept to factory floor, its throughput could be double or triple that of the block exposure system.
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To Help Reduce a Burden on the Developer |
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For block extraction to be efficient, the number of block types must not increase when an RTL coding is replaced with a physical layout. Thus, the heights of cells, the shapes of cells to be deployed, and the rules for power and ground line layout must be standardized (the last item is required to order the locations of holes). The most important concern in this respect is not to impose a burden on the developer. In IC device development, a division of labor between design and manufacturing is taking place. The reason is the importance placed on ensuring that the designer has the freedom to make a unique design without having to worry about manufacturing details. Therefore, for the E-Beam direct-write model, we are thinking of providing a conversion tool in a process after RTL coding has been completed. Since such a conversion tool could never be constructed only by those who providing the exposure system, Advantest intends to cooperate with the makers of EDA tools and cell libraries to create the required technologies.
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