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CMOS Image Sensor Test Solution
New, high-parallel test solution incorporates highspeed interface technology to enable evaluation and production test of advanced CMOS image sensors.
Flexible support for multifunction image sensors
CMOS image sensors are now incorporating functions such as AD/DA and other SoC circuits. T2000 modular architecture enables testing of these complex devices by configuring the tester with optimal instrument configurations to meet the test requirements at the lowest cost of test.
 
1.2Gbps high-speed image capture
The module's high-speed image-capture interface supports a variety of CMOS image sensors including mobile, DSC, DSLR, CAM, and industrial CIS. In addition, the large dual bank capture memory enables simultaneous data storage and data transfer to the image processing engine, minimizing test times significantly.

Differential input:
Serial data: 1.2Gbps, 4 lanes x 4 channel
Parallel data: 200M pixels/s, 16 bits x 4 channel

Large capture memory: 128M pixels x 2 banks
Capable of storing continuous image data of up to 255 frames

Parallel testing up to 64 devices
The module's ultra high-volume simultaneous measurement capability enables uniquely high productivity and a significant cost savings for image sensor testing. And, most importantly, the system's optimized, and uniform light source and large user area enables 64-parallel testing of ultra-high-density and quality, as well as high-performance devices.。


440mm probe card and 2048ch Frog Unit (pogo interface)

User area: 252 x 208mm
Large exposure area: 160 x 150mm
Parallel testing up to 64 devices
T2000 module configuration for CMOS image sensor testing
800MDM (800/500Mbps)
128 I/O pins per module
SCAN Test Function
Memory Test Function
High Voltage Digital Pin
Source Synchronous Tests
Multi Time Domain
1.2GICAP (1.2Gbps)
Serial Input
  Data Rate: 1.2Gbps
Data: 4 port x 4ch, Clock: 1 port x 4ch
Parallel Input
  Data Rate: 200M pixel/s
Data: 16bit x 4ch,
Clock: 1bit x 4ch
Trigger: 1bit x 4ch
Capture Memory
  Memory Capacity: 128M pixel/bank
Memory Bank: 2 bank/ch
CMOS Image Sensor SoC
 
PMU32 for ADC/DAC
32 DC pins per module
High Speed DC Linearity Test
Wide Coverage of Voltage
  Range (±0.7V to ±40V)
200mA Maximum Output
DPS500mA
32 DC per module
500mA Maximum Output

LSMF+EXMFIS
Test Head Slots : 46 slots
MF Size: 800(W) x 1050(D) x 1600(H)mm
+1100(W) x 1050(D) x 1600(H)mm
 
 
T2000
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