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Terahertz Spectroscopic / Imaging Analysis System
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Electronic Measuring Instruments
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Using vision alignment in handling every type of device
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The M4741A achieves solid contact with narrowpitch/ miniature devices with advanced functionality, such as those used in mobile equipment.
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Positioning using vision alignment
Alignment using mechanical guidance is trending toward miniaturization and narrowing pitch, resulting in deterioration of contact performance. The M4741A, however, employs vision alignment to position sockets and devices. Therefore, it can achieve solid contact with devices that both are very small and are characterized by narrow pitch. Also, the unique structure of the product is designed to avoid drops in throughput induced by test conditions. A series of tests can be performed within the time taken by device replacement.
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Dramatically reducing the cost of deploying new models
Vision alignment has greatly increased sharing of device change kits. In particular, area-array devices, typified by CSP, can be handled under certain conditions by other products without the need for a change kit replacement. As a result, increasing productdeployment costs and development time limitations, and other management concerns are largely mitigated.
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Providing a rich menu of options
The M4741A is rich in options to promote improved productivity and asset inheritance. For example, the layout unit adapts to a given socket's particular layout, which is optimized according to test conditions. This capability makes possible flexibility of layout. Other available options include measures to prevent static electricity from damaging devices, as well as highprecision maintenance of a set temperature.
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| Major Specifications |
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| Target Packages: |
CSP, BGA, QFP, etc. |
| Simultaneous Testing: |
Up to 4 devices |
| Throughput: |
4,000 devices per hour |
| Temperature Range: |
Room temperature, +50 to +125 degrees C (optional) |
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