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Terahertz Spectroscopic / Imaging Analysis System
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Electronic Measuring Instruments
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Achieves Design Quality Verification
of Advanced VLSI, and Reduces
the Time to Design VLSI.
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| E1380A and E1380P
allow high-speed and high-accuracy
design quality verification, with
high accuracy and high stability
probing technologies for the advanced
device design rules, and ease
of operation using industry-standard
GUI. Further, the E1380A and E1380P
achieve compact and single-piece
construction, direct docking that
has little effect on operating
conditions, and a short analyzing
time. |
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By automatically controlling
electron-beam alignment and gain adjustment
at the time of waveform measurements, operation
is improved.
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Allows direct docking suitable
for timing verification of advanced high-speed
devices.
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Various analyzing tools (device
interface, CAD navigation software) have contributed
to shortening of turn around time (TAT).
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Semi-automated contacting,
controlling and Die-to-Die movements have
contributed to ease of operation and high
reliability (E1380P).
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E1380A |
E1380P |
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Target Devices: |
Target Devices |
Wafer
(up to 8 inches)
Up to diameter 300nm of Probe
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Up to 512 pins |
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Probe Range: |
30mm x 30mm (max) |
Up
to 8 inches wafer face |
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Beam Diameter: |
0.1micro-m |
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Measurement Band: |
8.75GHz |
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Minimum Pulsed
Beam Width: |
40ps |
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Settable Time
Resolution: |
5ps |
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Noise level: |
5mVrms |
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