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SEM Metrology/Review


As semiconductor device features continue to shrink, photomask patterning challenges have created new requirements for highly precise, stable metrology. Advantest's E3600 series is already in use by multiple leading semiconductor and photomask manufacturers.

E3630 NEW


New SEM tool supports next-generation photomasks with improved performance and accuracy


E3630
E3630 is a new SEM - based Multi Vision Metrology (MVM) measurement system for nextgeneration photomasks and patterned media.
This system's newly developed object lens and low-vibration platform enable significantly improved measurement performance compared with previous models, while a new, multi-channel detection system and unique measurement algorithm make 3D measurement possible.
E3630 makes a significant contribution to reducing process development turnaround time (TAT) and improves productivity for next-generation masks.

The following can be measured:

Advanced photomask and EUV mask
Templates for Nanoimprinting
Patterned media


E3620


A variety of kinds of Mask type can be measured with hi-accuracy and automation


E3620
The E3620 is a Scanning Electron Microscope (SEM)-based Critical Dimension (CD) measurement system for photomasks.
This CD SEM metrology system was designed specifically for 45nm technology node production and 32nm process development.
Its proprietary technology, the feature column design and a unique electron beam scanning, compensates a particular charging effect for photomasks measurement. The column design which employs hi-voltage inside column, enables to achieve hi-resolution with lower operation voltage. Additionally the beam blanking system which is newly employed minimizes the charging effect with the combination of unique scanning system. Upon those technologies E3620 has realized high-steady imaging and high-accurate measurement.
Moreover, the stage system with Advantest designed laser interferometer system makes nano meter order positioning accuracy.
E3620 is possible the highly accurate measurement of photomasks of all types including With all of technology above the template of mask and Nanoimprint pattern drawing (NIL) and EUV Mask.
sub nano meter order measurement accuracy in depended on Mask type
Sub 1nm long-term measurement repeatability by unique column design
High-Accurate positioning system combined laser stage with sophisticated software
Automation job set up by any EDA tool