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3D Imaging Analysis System
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Electronic Measuring Instruments
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| Low cost, high throughput EBDW system writes circuits of 65nm and smaller |
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The F3000 is an EB lithography system optimized for system LSIs of 65nm and smaller, supporting 300 wafer process technology, that offers shorter TATs in high-mix, variable-volume production environments.
Inheriting the high-resolution electron optical technology, the reliability, and the high average operation rate of previous models, the F3000 also boasts a more rigid body and upgrades to every aspect of its functionality, leading to significant improvements in image placement accuracy.
As a further measure to enhance lithographic processing capacity and pattern characteristics, the F3000 is equipped with an upgraded block exposure function.
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Ideal for writing system LSIs in high-mix, variable-volume production environments
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High resolution, high accuracy, high throughput
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Supports 300mm wafers
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Offers full & partial block exposure functionality
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F3000 |
| Supported Wafer Size |
300mm |
| Minimum Line Width |
<=40nm |
| Dimensional Accuracy |
<=7nm |
| Overlay Accuracy |
<=20nm |
| Drawing Method |
Block exposure system |
| Maximum # of Blocks Selectable |
100 |
| Block Magnification |
60x |
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 Technology Introduction |
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| Benefits to Use |
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