The F7000 is an EB lithography tool with superior resolution performance meeting requirements for the 1Xnm technology node. The F7000 supports substrates of diverse materials, sizes, and shapes, including nano-imprint templates, as well as wafers, and is optimized for diverse applications such as advanced LSIs, photonics, MEMS, and other nano-processes. Also, users can select the configuration optimal for their needs, either stand-alone or in-line, enabling the F7000 to support a wide array of applications from R&D to volume production.

The F5113 is an electron-beam lithography system supporting 200mm and 3-inch through to 6-inch substrates, making it an optimal tool for processing advanced LSIs, compound semiconductor wafers, magnetic heads, smart power devices, photonics devices, MEMS, and other devices requiring ultrafine-pitch fabrication.

The F5113's character projection (CP) functionality offers high resolution, excellent pattern fidelity, and high throughput. High-speed pattern exposure with CP enables a broad range of applications, including materials R&D and evaluation.

Advantest's proprietary self-cleaning technology massively improves the stability of the electron beam used by the F5113, contributing to higher utilization ratios and lower customer running costs across the spectrum of applications.