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Fujitsu and Advantest to Establish Joint Venture to Create Semiconductor Prototypes Using Electron Beam Direct Lithography
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Tokyo, September 15, 2006 - Fujitsu Limited and Advantest Corporation today announced plans to establish a joint venture to create prototype semiconductors by using electron beam direct lithography*, a technology that combines 65 nanometer (nm) and 45 nm semiconductor process technologies with electron beam exposure systems. The companies are currently discussing the terms of a formal contract, targeting November for this year for establishment of the joint venture.
The joint venture will combine leading-edge semiconductor process technology from Fujitsu with electron beam exposure systems developed and manufactured by Advantest, to develop electron beam direct lithography applicable for 65nm and 45nm process technologies.
Advantest plans to newly develop electron beam exposure systems applicable for 65nm and 45nm process technologies, and supply the systems to the joint venture. The joint venture and Fujitsu plan to collaborate to develop process technologies that are suited for electron beam direct lithography. The companies are targeting practical application of electron beam direct lithography on 300 millimeter (mm) wafers for 65 nm process technology as a world's first.
Using technologies it develops, in fiscal 2007 the joint venture plans to provide customers with 65nm process prototype services (shuttle services) as a new development environment, and make the environment suitable for 45nm process technologies in the future.
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| Overview of the joint venture (tentative): |
| Date of establishment: |
November, 2006 |
| Share ratio: |
Fujitsu Limited: 55%, Advantest Corporation: 45% |
| Headquarters: |
Within Fujitsu's current facilities |
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| Glossary |
*Electron beam direct lithography:
A technology in which circuit patterns for semiconductor systems are directly drawn on a wafer, by using a beam formed by accelerating and concentrating electrons. |
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Fujitsu is a leading provider of customer-focused IT and communications solutions for the global marketplace. Pace-setting device technologies, highly reliable computing and communications products, and a worldwide corps of systems and services experts uniquely position Fujitsu to deliver comprehensive solutions that open up infinite possibilities for its customers' success. Headquartered in Tokyo, Fujitsu Limited (TSE:6702) reported consolidated revenues of about 4.8 trillion yen (US$40.6 billion) for the fiscal year ended March 31, 2006.
See http://www.fujitsu.com for further information.. |
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Advantest Corporation is the world’s leading automatic test equipment supplier to the semiconductor industry, and also produces electronic and optoelectronic instruments and systems. A global company, Advantest has long offered total ATE solutions, and serves the industry in every component of semiconductor test: tester, handler, mechanical and electrical interfaces, and software. Its logic, memory, mixed-signal and RF testers and device handlers are integrated into the most advanced semiconductor production lines in the world. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has 40 subsidiaries worldwide. Among them, Advantest America, Inc. is based in Santa Clara, CA., and Advantest (Europe) GmbH is based in Munich, Germany.
More information is available at http://www.advantest.co.jp/en-index.shtml. |
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| Fujitsu Customer Contact: |
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Overseas Business Strategy & Planning Dept.
Strategic Business Development Div.
Electronic Systems Business Group
Fujitsu Limited
Tel: +81-3-5322-3347
e-mail: edevice@fujitsu.com |
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| Advantest Customer Contact: |
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Toshio Edamoto
Customer Support Department
Nanotechnology 1st Business Division
Tel: +81-480-72-6300
e-mail: e-ebdw@jp.advantest.com |
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| All company names herein are trademarks or registered trademarks of their respective owners. Information supplied herein is correct at the time of publication, but may be subject to change without warning. |
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| Note: |
All information supplied in this release is correct at the time of publication, but may be subject to change without warning. |
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